Machining – functional surfaces

Development and testing of hybrid production processes

Innovative processing technologies are being developed using active media and superposition of motion. By designing functionally micro-structured surfaces, aspects such as tribology, sealing and joining technologies and haptics can be influenced in a specific manner.

Fields of activity

  • Dimensioning of components, configuration of production processes and process chains for powertrain components, micro-structure components and forming tools
  • Numerical simulation of processing technologies and tools
  • Process development in the field of machining processes with geometrically defined and geometrically undefined cutting edges as well as erosion processes
  • Development of hybrid processing technologies using oscillations, heat or cooling technologies and coolant pressure
  • Experimental property analysis

Electrochemical precision erosion of rotating workpieces

Electrochemical precision erosion can be used to reduce the mechanical and thermal influence on surfaces, substitute processing stages and produce roughnesses in a specific manner.

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Surface functionalization and microstructuring using laser systems

At Fraunhofer IWU, research is being conducted on microstructuring using short-pulse and ultra-short-pulse lasers in order to produce 2½D and 3D micro-structures. The development objective is the processing of flat and rotationally symmetrical components and free-form surfaces.

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Resource-efficient fine processing of crankshafts

Implementing tool and process developments in the area of fine processing will allow for significant reductions in primary processing times compared to grinding, as well as in energy consumption.

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© Fraunhofer IWU

Turning difficult-to-machine bronze materials

Due to modified material properties when switching the production of rod bearings for combustion engines to lead-free bronze materials, research must be conducted concerning required adaptations to adjust to the change of the machining process. With this aim in mind, solution concepts are being developed for problems relating to chip breaking and the adherence to required quality parameters due to the omission of lead.

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